GSEF Virtual Series 2021 continue in its new format of highly focused online events and present the second virtual conference Semiconductor Innovation: More than Moore and moving to the edge.
As more processing is pushed to the edge, the data from automobiles, robots, drones, and smart devices will increasingly be processed in-device. This distributed model will help reduce network congestion and cyber threats. These integrated application-specific design solutions will require different approaches to device scaling to be successful.
In this spotlight conference through case studies, presentations, panel discussions, interviews and Q&A sessions we will cover more than Moore evolution, edge computing, edge AI chips, advanced fab processing, metrology/inspection and advanced testing and heterogeneous integration.
The event will enable you to build new partnerships, identify more contacts, exchange ideas and initiatives with a targeted audience of companies and delegates who influence change and development across the semiconductor value chain.
Chief Technology Officer, EDA/Semiconductor
Corporate Vice President of Global Quality
Chief Technology Officer and Executive Vice President
Principal Analyst, Thematic Research
Global Product Director for Semiconductor, Lead Frame and Connectors
Thematic Research Consultant
Director Systems & Automation