About The Event

GSEF Virtual Series 2021 continue in its new format of highly focused online events and present the second virtual conference Semiconductor Innovation: More than Moore and moving to the edge.

As more processing is pushed to the edge, the data from automobiles, robots, drones, and smart devices will increasingly be processed in-device. This distributed model will help reduce network congestion and cyber threats. These integrated application-specific design solutions will require different approaches to device scaling to be successful.

In this spotlight conference through case studies, presentations, panel discussions, interviews and Q&A sessions we will cover more than Moore evolution, edge computing, edge AI chips, advanced fab processing, metrology/inspection and advanced testing and heterogeneous integration.

The event will enable you to build new partnerships, identify more contacts, exchange ideas and initiatives with a targeted audience of companies and delegates who influence change and development across the semiconductor value chain.


Media Partners



KEYNOTE: The driving forces behind edge computing and the more than Moore evolution

  • Evaluating the sustainability of continued scaling in semiconductor manufacturing
  • How the industry is innovating to meet the challenge of growing markets
  • The intuitive technology enabling more than Moore devices
Mark Papermaster, CTO and EVP, AMD

Advanced packaging requirements and solutions to enable next generation edge computing and more than Moore devices

  • Assessing the variation of packaging techniques and technologies that more than Moore and edge computing bring
  • Evaluating how the trend to do this with more precision and more cost effectiveness is continuing
  • Unpacking this interesting challenge and the new opportunities it opens
Ruurd Boomsma, CTO, BESI                 

PANEL DISCUSSION: The generation and use of data in fab processing

  • How can processes be streamlined using big data?
  • What are the data requirements for advanced fab processing?
  • How can AI & ML be utilised in advanced fab processing?
  • Creating a roadmap for big data efficiently to enable predictive maintenance and improve OEE
Moderated by Matt Gooding, News Editor, Tech Monitor
Balachandran Rajendran, Chief Technology Officer, EDA/Semiconductor, Dell EMC
Laith Altimime, President, SEMI Europe
Raj Narasimhan, Corporate VP of Global Quality, Micron Technology

Networking Break


PRESENTATION: Technology pushes limits – With in-house and custom-designed Cu additives to market ready electrodeposition process solutions

  • Next Level advanced packaging developments: market and technology trends
  • Technology requirements for RDL, pillar plating and Cu-to-Cu bonding
  • How do we translate this into chemistry and equipment products?
  • Examples: UF3 – RDL plating, UF5 – Pillar plating, Cu-to-Cu bonding, MultiPlate – PLP, novel vertical PTH tool for ICS
Christian Ohde, Global Product Director for Semiconductor, Lead Frame and Connectors, Atotech Group    

PRESENTATION: More than Moore and heterogeneous integration through packaging: unleashing opportunities for the semiconductor ecosystem

  • The explosive growth in data driven by data centric transformation, the artificial intelligence and cloud computing driving IC technology and business growth
  • Heterogenous integration through packaging and the critical role it plays in delivering complex and high-performance computing platforms
  • The opportunities and challenges ahead for the equipment and manufacturing ecosystems
Islam Salama,Vice President,Intel

LIVE PRESENTATION: How to keep testing of new generation silicon affordable in the future?

  • Testing and validating future silicon require increasingly advanced and often dedicated technologies and tooling, demanding regular and significant investments
  • However, who can afford the necessary ATE instrument development, when you are not a ‘’Fruit’’ company, while the development is getting more complex & expensive?
  • Fewer ATE providers can justify the ROI on these new technologies
  • Salland is making headway in creating affordable enabling technology to test future technologies like MEMS, Photonics and Quantum technology testing
Paul van Ulsen, CEO, Salland Engineering        

CLOSING KEYNOTE INTERVIEW: The rise of edge computing and AI in the chip manufacturing industry

  • Unpacking the evolution of AI and edge computing processes in manufacture and their impact on the market
  • Enabling the desired quality for new customers with next gen tech and accelerators - what are the roadblocks?
  • Discussing the market impact: technology vectors for next market growth around secure edge
Herve Charles, Director Systems & Automation, NXP Semiconductors
Interviewed by Mike Orme, Thematic Research Consultant, GlobalData


Balachandran Rajendran

Chief Technology Officer, EDA/Semiconductor

Dell EMC

Islam Salama

Vice President


Ruurd Boomsma



Paul van Ulsen


Salland Engineering

Raj Narasimhan

Corporate Vice President of Global Quality

Micron Technology

Mark Papermaster

Chief Technology Officer and Executive Vice President


David Bicknell

Principal Analyst, Thematic Research


Matthew Gooding

News Editor

Tech Monitor

Laith Altimime


SEMI Europe

Dr. Christian Ohde

Global Product Director for Semiconductor, Lead Frame and Connectors

Atotech Group

Mike Orme

Thematic Research Consultant


Herve Charles

Director Systems & Automation

NXP Semiconductors

Lil Read

Thematic Analyst


Contact Us

For any enquiries about the event, please contact:

Gail Afonso on on Gail.Afonso@ns-mediagroup.com

To enquire about sponsorship opportunities, please contact:

Pratheeva Kotalawela on on  pratheeva.kotalawela@progressivemediainternational.com